The wafers that have been polished with great care are judged to be "defective" in the final inspection, and the yield does not increase.
Do you have any such challenges?
The final height measurement is the "announcement of the results." However, if any problems are discovered at that point, it is already too late.
What's important is to know what's happening during the polishing process.
The key is invisible "temperature."
Temperature variations during polishing are the biggest factor that affects the final quality.
This document introduces specific solutions for stabilizing the polishing process through temperature.
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