Chapter 1
What is semiconductor measurement? Let's start with a simple explanation.
Semiconductor measurement is process control that supports quality, yield, and safety.
Semiconductors are manufactured through a series of extremely fine structure and numerous process. If production proceeds without verifying the status at each process, issues such as dimensional deviations, variations in film thickness, defects, fluctuations in temperature conditions, and changes in environmental conditions may go unnoticed, potentially affecting quality and yield.
Therefore, in semiconductor manufacturing, it is important not only to check the finished product, but also to measure and record what is happening during process and use that information to implement control and improvements as needed.
Differences between measurement, testing, inspection, and monitoring
Terms like "semiconductor measurement equipment," "semiconductor inspection equipment," and "semiconductor measuring instruments" are often used with similar meanings once you start researching them. When considering implementation, it's important not to just look at the differences in terminology, but to clearly define "what you want to know."
| term | Way of thinking | Examples in semiconductor manufacturing |
|---|---|---|
| Measurement | It is the act of measuring the state of an object using numerical values. | It measures temperature, film thickness, dimensions, humidity, etc. |
| Measurement | This approach involves understanding the overall state of the system, including not only the measured values but also accuracy, error, measurement methods, and equipment conditions. | process is managed, including measurement points, measurement range, measurement method, and recording method. |
| Inspection | This is a method for checking for defects, pass/fail status, and conformity to specifications. | Check for pattern defects, foreign matter, appearance, and electrical characteristic. |
| Monitoring | This approach involves continuously visualizing the state of things so that abnormalities and changes can be noticed. | Continuously monitor temperature, humidity, device status, alerts, and history. |
If you'd like to learn about semiconductors from the very basics, please also see "What are semiconductors?".
Chapter 2
What do semiconductor measuring devices and instruments measure?
Even within the category of semiconductor measurement equipment and instruments, the objects being measured are not limited to just one. The necessary equipment varies depending on the purpose, including devices for measuring pattern dimensions and film thickness on wafers, devices for checking for defects and foreign matter, devices for measuring electrical characteristic, and devices for monitoring process temperature and temperature/humidity.
Measure dimensions, film thickness, defects, and electrical characteristic.
As semiconductor device become more miniaturized, understanding factors such as line width, overlap, film thickness, surface condition, and defects becomes increasingly important. These measurements are used to verify that process conditions are as intended and that the product functions as designed.
Measure temperature, temperature/humidity, and environmental conditions.
Chino is particularly adept at supporting areas related to temperature, temperature/humidity, recording, monitoring, control, and calibration. In processes such as crystal growth, CVD, diffusion, heat treatment, CMP, storage, and cleanrooms, temperature and environmental conditions can affect process stability.
Consider everything from recording, monitoring, control, and calibration.
In semiconductor manufacturing, it is important to verify not only the measurement value at a single point in time, but also the temperature history, trends in changes, records of anomalies, control status, and the reliability of the measurement values.
| Object to measure | Main purpose | Examples of related devices and equipment |
|---|---|---|
| Dimensions and shape | Check if the patterns and structure are as intended. | Measuring devices, image measuring devices, etc. |
| Film thickness and material characteristic | Check the film deposition conditions and material state. | Film thickness gauges, analytical instruments, etc. |
| Defects/Foreign objects | Identify any abnormalities that could lead to manufacturing defects or reliability risks. | Defect inspection equipment, visual inspection equipment, etc. |
| Temperature/temperature distribution | Understand process conditions for heat treatment, crystal growth, CVD, diffusion, CMP, etc. | Temperature sensors, radiation thermometer, thermal image measurement, recorders, controllers |
| temperature/humidity /environment | Understand changes in the cleanroom, storage, and surrounding environment of the equipment. | temperature/humidity meters, data loggers, monitoring systems, wireless devices |
| Reliability of measurement values | Check how reliable the measured values are compared to the standard. | Standard sensors, temperature calibration equipment, calibration services |
Chapter 3
Semiconductor manufacturing process and key measurement points
In semiconductor manufacturing, the objects being measured vary depending on process. Here, we've organized typical measurement points for each process to help those just starting to look for measuring devices and instruments get an overall picture.
| process /area | Main measurement points | Areas where Chino is likely to be involved |
|---|---|---|
| Wafer manufacturing and crystal growth | Temperature, temperature distribution, measurement location, and observation conditions during crystal growth. | radiation thermometer, temperature monitoring, recording |
| Oxidation, Diffusion, CVD | Furnace temperature, measurement location, sensor shape, temperature history, control status | Quartz protective tube thermocouple, recorder, controller, monitoring |
| Film deposition and heat treatment | process temperature, heating/holding/cooling conditions, surrounding environment of the equipment | Temperature sensors, radiation thermometer, controllers, recorders |
| CMP/polishing | Temperature changes and temperature variations during polishing, real-time monitoring. | Non-contact temperature measurement, temperature monitoring, data recording |
| Post-process /storage | Storage temperature/humidity, temperature history, presence or absence of deviations, environmental changes | temperature/humidity meter, data logger, wireless monitoring, recording |
| Cleanroom and related facilities | temperature/humidity, equipment condition, environmental stability, calibration history | temperature/humidity monitoring, recording, calibration, and remote monitoring. |
Chapter 4
Why temperature measurement is important in semiconductor manufacturing
Temperature variations affect process repeatability.
Semiconductor manufacturing involves many process process utilize heat or are sensitive to temperature conditions. If the temperature inside the furnace, on the wafer, on the crystal, on the polished surface, or in the storage environment is unstable, it can affect repeatability of process conditions and quality control.
In high-temperature process, the measurement method and installation conditions are crucial.
In high-temperature process such as diffusion furnaces and CVD furnaces, it is necessary to clarify which temperature data to collect, what shape of sensor to use, and how to use it for control and recording.
By checking the furnace shape, insertion port, measurement position, temperature range, and maintainability, it becomes easier to consider a suitable measurement configuration.
Situations where non-contact temperature measurement is effective
Non-contact temperature measurement using radiation thermometer can be effective when it is difficult to touch the object being measured, when measuring moving objects or high-temperature objects, or when it is necessary to avoid contact with the object.
During the selection process, we check factors such as temperature range, measurement distance, target size, emissivity, measurement window, and surrounding environment.
Situations where temperature/humidity need to be recorded and monitored.
In cleanrooms, storage areas, equipment environments, and test environments, changes in temperature/humidity can affect process and quality control. Considering not only on-site display but also historical records, anomaly alerts, remote monitoring, and calibration history makes post-implementation verification easier.
Chapter 5
Semiconductor measurement solutions based on challenges
Yeld Improvement
We want to improve the yield.
We identify variations in process conditions and temperature unevenness to investigate the causes and consider improvements.
Furnace temperature
I want to stably measure the temperature inside the furnace and on the wafers.
In diffusion furnaces and CVD furnaces, it is important to organize the measurement location, sensor shape, temperature history, and how to connect them to control and monitoring systems.
Crystal Growth
I want to measure the temperature for SiC crystal growth and single crystal pulling.
In crystal growth, we verify temperature measurement in the high-temperature range, measurement location, observation conditions, and connection to external systems.
CMP / Polishing
I want to understand the temperature changes during the CMP (Chemical Polishing process.
In polishing process, a challenge arises in how to capture objects that are difficult to contact or phenomena that change rapidly. Non-contact temperature measurement and real-time monitoring may be considered.
Cleanroom / Storage
I want to monitor temperature/humidity of cleanrooms and storage environments.
Organizing the representative points for temperature/humidity, the number of measurement points, the recording intervals, alerts, remote monitoring, and calibration support will make it easier to consider configuration that suits your operations.
Calibration
We want to improve calibration and traceability.
When using measured values for quality control or audits, you should check the calibration range, calibration points, calibration cycle, and whether a certificate is required.
FAQ
Frequently asked questions
What is semiconductor measurement?
This initiative involves measuring dimensions, film thickness, defects, electrical characteristic, temperature, temperature/humidity, and atmosphere—all necessary for semiconductor process—to verify process conditions and quality.
What is a semiconductor measurement device used for?
These devices allow you to check the condition of wafers, films, patterns, and process environments using numerical data and images. The specific device used will vary depending on the purpose, such as measuring length, film thickness, defects, temperature, and temperature/humidity.
Are semiconductor measuring instruments and semiconductor testing equipment different?
The precise distinction between the two terms varies depending on the field and company. Generally, measurement is used to describe the process of understanding the state of an object numerically, while inspection is used to describe the process of checking for defects or determining whether something is acceptable or not.
Why is temperature measurement important in semiconductor manufacturing?
Temperature conditions can affect crystal growth, CVD, diffusion, heat treatment, CMP, and storage environment. Measuring, recording, monitoring, control, and calibrating temperature helps stabilize process.
How do you differentiate between contact-type and non-contact-type semiconductor process?
If you need to touch the object or want to measure its internal temperature, a contact-type thermometer is suitable. For high-temperature objects that are difficult to touch, moving objects, or for measuring surface temperature, a non-contact type thermometer is a better choice. In practice, the selection should be made after checking the temperature range, measurement distance, response speed, emissivity, and installation environment.
What kind of temperature measurements are necessary in CVD furnaces and diffusion furnaces?
We will examine the relationship between furnace temperature, measurement location, temperature distribution, sensor shape, and control /recording. Having information on furnace shape, insertion port, temperature range, and existing sensors will facilitate the analysis.
Are calibration and traceability necessary for semiconductor measurement?
This is important when using measured values for quality control, audit compliance, research development, and process condition comparison. To maintain the reliability of the measured values, check the calibration range, calibration points, calibration cycle, and whether a certificate is required.
If I'm researching semiconductor measurement for the first time, what should I check first?
First, clarify what needs to be measured, at what process, and for what purpose. Next, confirm the object to be measured, the temperature range, the required accuracy, whether contact is permitted, and whether recording, monitoring, and calibration are necessary. This will help narrow down the necessary measuring devices and instruments.
Next
Learn more about semiconductor measurement
Systematically examining temperature control
View information other than semiconductors
I need advice on temperature measurement, monitoring, and calibration in semiconductor manufacturing process.
After organizing process, measurement target, temperature range, whether recording and monitoring are necessary, and calibration conditions, please consider a temperature measurement, temperature/humidity monitoring, control, and calibration configuration that suits your application.
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