What is semiconductor measurement? Let's review the key points in 30 seconds.
Semiconductor measurement involves measuring dimensions, film thickness, defects, electrical characteristic, temperature, temperature/humidity, atmosphere, and constituent—all necessary during the semiconductor manufacturing process—to verify process conditions and quality. The measurement results are used for reviewing process conditions, investigating the causes of defects, improving yield, responding to audits, and maintaining equipment.
- Semiconductor measurement: This approach involves understanding process, including measured values, errors, accuracy, measurement methods, and equipment conditions.
- Semiconductor measurement equipment and instruments: These are devices and instruments that perform measurements according to the purpose, such as dimensions, film thickness, defects, temperature, and temperature/humidity.
- Temperature measurement: This is involved in process stabilization in areas such as crystal growth, heat treatment, CVD, diffusion, CMP, and storage environments.
- Chino's areas of support: Temperature management combining temperature sensors, radiation thermometer, recorders, controllers, temperature/humidity, monitoring, calibration, and more.
Chapter 1
What is semiconductor measurement? Let's start with a simple explanation.
Semiconductor measurement is process control that supports quality, yield, and safety.
Semiconductors are manufactured through a series of extremely fine structure and numerous process. If production proceeds without verifying the status at each process, issues such as dimensional deviations, film thickness variations, defects, temperature fluctuations, and changes in environmental conditions may go unnoticed, potentially affecting quality and yield.
Therefore, in semiconductor manufacturing, it is important not only to check the finished product but also to measure and record what happens during the process, and to control and improve it as needed.
Differences between measurement, testing, inspection, and monitoring
Terms like "semiconductor measurement equipment," "semiconductor inspection equipment," and "semiconductor measuring instruments" are often used interchangeably. When considering implementation, it's more important to clarify what you want to know than to focus on the differences in terminology.
| term | Way of thinking | Examples in semiconductor manufacturing |
|---|---|---|
| Measurement | It is the act of measuring the state of an object using numerical values. | It measures temperature, film thickness, dimensions, humidity, etc. |
| Measurement | This approach involves understanding the overall state of the system, including not only the measured values but also accuracy, error, measurement methods, and equipment conditions. | process is managed, including measurement points, measurement range, measurement method, and recording method. |
| inspection | This is a method for checking for defects, pass/fail status, and conformity to specifications. | Check for pattern defects, foreign matter, appearance, and electrical characteristic. |
| Monitoring | This approach involves continuously visualizing the state of things so that abnormalities and changes can be noticed. | Continuously monitor temperature, humidity, device status, alerts, and history. |
For those learning about semiconductors for the first time
If you want to learn about semiconductors from the beginning, understanding their properties, materials, doping, PN junctions, and common applications will make it easier to grasp why measurement is necessary.
If you'd like to review the basics, please also see the related page, "What are semiconductors?". This page will keep the basic explanation of semiconductors themselves brief and focus on measurement and temperature control in semiconductor manufacturing.
Chapter 2
What do semiconductor measuring devices and instruments measure?
Even within the category of semiconductor measurement equipment and instruments, there isn't just one type. The necessary equipment varies depending on the purpose, including devices for measuring pattern dimensions and film thickness on wafers, devices for checking for defects and foreign matter, devices for measuring electrical characteristic, and devices for monitoring process temperature and temperature/humidity.
Measurement to measure dimensions, film thickness, defects, and electrical characteristic.
As semiconductor device become more miniaturized, understanding line width, overlap, film thickness, surface condition, and defects becomes increasingly important. These measurements are used to verify that process conditions are as intended and that the product functions as designed.
Measurement of temperature, temperature/humidity, atmosphere, and constituent.
Chino is particularly adept at supporting areas related to temperature, temperature/humidity, recording, monitoring, control, and calibration. In processes such as crystal growth, CVD, diffusion, heat treatment, CMP, storage, and cleanrooms, temperature and environmental conditions can affect process stability.
Reasons for considering recording, monitoring, control, and calibration as a whole.
In semiconductor manufacturing, it is crucial to verify not only the measurement value at a single point in time, but also the temperature history, trends in changes, records of anomalies, control status, and the reliability of the measurement values. Connecting the processes of measuring, recording, monitoring, control, and calibrating makes it easier to gather the necessary information for on-site decision-making.
| Object to measure | Main purpose | Examples of related devices and equipment |
|---|---|---|
| Dimensions and shape | Check if the patterns and structure are as intended. | Measuring devices, image measuring devices, etc. |
| Film thickness and material characteristic | Check the film deposition conditions and material state. | Film thickness gauges, analytical instruments, etc. |
| Defects/Foreign objects | Identify any abnormalities that could lead to manufacturing defects or reliability risks. | Defect inspection equipment, visual inspection equipment, etc. |
| Temperature/temperature distribution | Understand process conditions for heat treatment, crystal growth, CVD, diffusion, CMP, etc. | Temperature sensors, radiation thermometer, thermal image measurement, recorders, controllers |
| temperature/humidity /environment | Understand changes in the cleanroom, storage, and surrounding environment of the equipment. | temperature/humidity meters, data loggers, monitoring systems, wireless devices |
| Reliability of measurement values | Check how reliable the measured values are compared to the standard. | Standard sensors, temperature calibration equipment, calibration services |
Chapter 3
Semiconductor manufacturing process and key measurement points
In semiconductor manufacturing, the objects being measured vary depending on process. Here, we've organized typical measurement points for each process to help those just starting to look for measuring devices and instruments get an overall picture.
| process /area | Main measurement points | Areas where Chino is likely to be involved |
|---|---|---|
| Wafer manufacturing and crystal growth | Temperature, temperature distribution, measurement location, and observation conditions during crystal growth. | radiation thermometer, temperature monitoring, recording |
| Oxidation, Diffusion, CVD | Furnace temperature, measurement location, sensor shape, temperature history, control status | Quartz protective tube thermocouple, recorder, controller, monitoring |
| Film deposition and heat treatment | process temperature, heating/holding/cooling conditions, surrounding environment of the equipment | Temperature sensors, radiation thermometer, controllers, recorders |
| CMP/polishing | Temperature changes and temperature variations during polishing, real-time monitoring. | Non-contact temperature measurement, temperature monitoring, data recording |
| Post-process /storage | Storage temperature/humidity, temperature history, presence or absence of deviations, environmental changes | temperature/humidity meter, data logger, wireless monitoring, recording |
| Cleanroom and related facilities | temperature/humidity, equipment condition, environmental stability, calibration history | temperature/humidity monitoring, recording, calibration, and remote monitoring. |
Chapter 4
Why temperature measurement is important in semiconductor manufacturing
Temperature variations affect quality and yield.
Semiconductor manufacturing involves many process process utilize heat or are sensitive to temperature conditions. If the temperature inside the furnace, on the wafer, on the crystal, on the polished surface, or in the storage environment is unstable, it can affect repeatability of process conditions and quality control.
In high-temperature process, the measurement method and installation conditions become crucial.
In high-temperature process such as diffusion furnaces and CVD furnaces, it is necessary to determine which temperature data to measure, which sensor shape to use, and how to use it for control and recording. Checking the furnace shape, insertion points, measurement locations, temperature range, and maintainability will make it easier to consider a suitable measurement configuration.
Situations where non-contact temperature measurement is effective
Non-contact temperature measurement using radiation thermometer can be effective when it is difficult to touch the object being measured, when measuring moving objects or high-temperature objects, or when it is necessary to avoid contact with the object. When selecting a device, check the temperature range, measurement distance, target size, emissivity, measurement window, and surrounding environment.
Situations where temperature/humidity need to be recorded and monitored.
In cleanrooms, storage areas, equipment surroundings, and test environments, changes in temperature/humidity can affect process and quality control. Considering not only on-site display but also historical records, anomaly alerts, remote monitoring, and calibration history makes post-implementation verification easier.
Chapter 5
Semiconductor measurement solutions based on challenges
Yeld Improvement
We want to improve the yield.
We identify variations in process conditions and temperature unevenness to investigate causes and consider improvements. In CMP and polishing process, real-time monitoring of temperature changes is a key consideration.
Furnace temperature
I want to stably measure the temperature inside the furnace and on the wafers.
In diffusion furnaces and CVD furnaces, it is important to organize the measurement location, sensor shape, temperature history, and how to connect them to control and monitoring systems.
Crystal Growth
I want to measure the temperature for SiC crystal growth and single crystal pulling.
In crystal growth, we verify temperature measurement in the high-temperature range, measurement location, observation conditions, and connection to external systems.
CMP / Polishing
I want to understand the temperature changes during the CMP (Chemical Polishing process.
In polishing process, a challenge arises in how to capture objects that are difficult to contact or phenomena that change rapidly. Considering non-contact temperature measurement or real-time monitoring may be effective.
Cleanroom / Storage
I want to monitor temperature/humidity of cleanrooms and storage environments.
Organizing the representative points for temperature/humidity, the number of measurement points, the recording intervals, alerts, remote monitoring, and calibration support will make it easier to consider configuration that suits your operations.
Calibration
We want to improve calibration and traceability.
When using measurement values for quality control or audits, you should check not only the measurement conditions but also the calibration range, calibration points, calibration cycle, and whether a certificate is required.
Chapter 6
Chino can support semiconductor measurement
Chino supports temperature control in semiconductor manufacturing through temperature sensors, radiation thermometer, thermal image measurement, temperature/humidity and hygrometers, recorders, controllers, data loggers, temperature calibration devices and standard sensors, and calibration services.
| Role | Main equipment and services | Concepts in semiconductor process |
|---|---|---|
| Measure | Temperature sensors, radiation thermometer, thermal image measurement, temperature/humidity meters | The method is selected based on the object to be measured, temperature range, measurement location, response speed, and whether contact is permitted. |
| Record | Recorder, data logger | We keep records that can be used for process conditions, history of abnormal events, audit responses, and root cause investigations. |
| Monitor | Surveillance systems, wireless equipment, software | We visualize temperature/humidity, and equipment status at multiple locations, allowing us to detect abnormalities and changes. |
| Control | Controllers, instrumentation systems | Based on the measured values, we will consider configuration brings process temperature closer to the target conditions. |
| Calibration | Temperature calibration equipment, standard sensors, JCSS calibration testing, on-site calibration services. | We help verify the reliability of measurement values and ensure traceability. |
Chapter 7
Things to consider before consulting about semiconductor measurement
When considering semiconductor measuring devices and instruments, the more specific the measurement target and process conditions, the easier it is to organize the necessary equipment configuration. Even if you haven't finalized your conditions yet, checking the following items will make it easier to proceed with the consultation.
| Check items | Things to organize |
|---|---|
| Measurement target and process | Where should measurements be taken: wafers, inside the furnace, crystals, polished surfaces, around the equipment, cleanrooms, storage areas, etc.? |
| Temperature range, required accuracy, response speed | Check room temperature, peak temperature, acceptable variability, and the rate at which you want to track the changes. |
| Selection criteria for contact-type and non-contact-type devices | We will check whether the target can be touched, the measurement distance, field of view, emissivity, measurement window, and installation space. |
| The need for recording, monitoring, and alerting. | We will determine whether on-site display is sufficient, or whether historical recording, remote monitoring, anomaly notification, and reporting are also necessary. |
| Relationship with control | We will determine whether the measurement values will be used solely for verification or connected to heaters or device control. |
| Calibration certificate and traceability | We will confirm whether the measurements are for quality assurance, audit compliance, or research and development, and whether calibration points or certificates are required. |
I need advice on temperature measurement, monitoring, and calibration in semiconductor manufacturing process.
After organizing process, measurement target, temperature range, whether recording and monitoring are necessary, and calibration conditions, please consider a temperature measurement, temperature/humidity monitoring, control, and calibration configuration that suits your application.
Contact usFAQ
Q. What is semiconductor measurement?
A. This initiative involves measuring dimensions, film thickness, defects, electrical characteristic, temperature, temperature/humidity, and atmosphere—all necessary for semiconductor process—to confirm process conditions and quality.
Q. What is a semiconductor measurement device used for?
A. This device allows you to check the condition of wafers, films, patterns, and process environments using numerical data and images. The device used will vary depending on the purpose, such as measuring length, film thickness, defects, temperature, and temperature/humidity.
Q. Are semiconductor measuring instruments and semiconductor testing equipment different?
A. The precise distinction between the two terms varies depending on the field and company. Generally, measurement is used to describe the process of understanding the state of an object numerically, while inspection is used to describe the process of checking for defects or determining whether something is acceptable or not.
Q. Why is temperature measurement important in semiconductor manufacturing?
A. Temperature conditions can affect crystal growth, CVD, diffusion, heat treatment, CMP, storage environment, and more. Measuring, recording, monitoring, control, and calibrating the temperature is essential for process stability.
Q. How are contact and non-contact methods used in semiconductor process?
A. If you want to touch the object or want to see its internal temperature, a contact-type thermometer is suitable. If you want to see the temperature of a high-temperature object that is difficult to touch, a moving object, or a surface temperature, a non-contact type thermometer is a good choice. In practice, the selection should be made after checking the temperature range, measurement distance, response speed, emissivity, and installation environment.
Q. What kind of temperature measurements are necessary in CVD furnaces and diffusion furnaces?
A. We will confirm the relationship between the furnace temperature, measurement location, temperature distribution, sensor shape, and control /recording. Having information on the furnace shape, insertion port, temperature range, and existing sensors will facilitate the analysis.
Q. Are calibration and traceability necessary for semiconductor measurement?
A. This is important when using measured values for quality control, audit compliance, research development, and process condition comparison. To maintain the reliability of the measured values, check the calibration range, calibration points, calibration cycle, and whether a certificate is required.
Q. If I'm researching semiconductor measurement for the first time, what should I check first?
A. First, clarify what needs to be measured, at which process, and for what purpose. Next, confirm the measurement target, temperature range, required accuracy, whether contact is permitted, and whether recording, monitoring, and calibration are necessary. This will help narrow down the necessary measuring devices and instruments.
Reference information
- CHINO Corporation "Semiconductor Measurement"
- CHINO Corporation "What is temperature measurement for diffusion furnaces and CVD furnaces?"
- CHINO Corporation "Products and Services"
- CHINO Corporation "radiation thermometer"
- CHINO Corporation "Temperature Calibration Devices and Standard Sensors"
- Hitachi High-Tech: "Measurement and inspection of semiconductors"
This page utilizes AI assistance for reviewing configuration and organizing the text. The content is based on publicly available information and CHINO Corporation 's product and service information. Product specifications, support conditions, and calibration scope may change, so please check the latest product and service information when considering implementation.
